Wire Bond Surface Coining Base Transistor Outline Package

Product Categories

Hermetically Sealed Electronic Packages [19]
Hermetic High Power Laser Package [7]
Hermetic Optical Fiber Communication Package [15]
Butterfly Package [6]
Transistor Outline Package [12]
Hybrid Integrated Circuit Package [4]
Hermetic Infrared Detector Package [3]
TO46 Package [3]
Laser Crystals [7]
Optical Windows [5]
Optical Lens [3]
Optical Prisms [2]
Optical Filters [1]
Polarized Beamsplitter [3]
Wafers And Substrates [2]

JOPTEC LASER CO., LTD

Contact Now

Wire Bond Surface Coining Base Transistor Outline Package

Contact Now

Wire Bond Surface Coining Base Transistor Outline Package

Product Name Robust Coining Base with A Large Diameter Wire Bond Surface Product Model JOPTEC Plating Coating Fully plating Au or selective plating Au Finish Shell and pins are plated Ni:2~11.43um and ...

Product Tags:

8pin Transistor Outline header

4J42 cap Transistor Outline header

Fully plating transistor Case header

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	JOPTEC LASER CO., LTD
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!